In aerospace, military, and high-end electronics manufacturing, the ability of electronic components to withstand extreme rapid temperature changes directly determines the safety and service life of end products. MIL-STD-883, the standard test methods for microelectronic devices, clearly defines requirements for temperature shock testing to simulate component durability under fast temperature‑varying conditions. However, many companies encounter two major challenges in practical testing: slow temperature transition that fails to meet the minute‑level high‑low temperature switching required by the standard, and degraded sealing performance after long‑term operation, leading to inaccurate test results.