The JPCA-ET05 High-Low Temperature Test Chamber plays a vital role in the Bluetooth chip industry, serving as a core testing device to guarantee chip performance and reliability. Bluetooth chips, as key components enabling 

short-range wireless communication, are widely used in various electronic products such as mobile phones, earphones, and vehicle systems. To ensure their stable operation under extreme temperature conditions, rigorous 

environmental adaptability testing via a high-low temperature test chamber is essential.

During the manufacturing process of Bluetooth chips, potential defects may surface in high or low-temperature environments, leading to communication interruptions, signal attenuation, or functional failures. The high-low temperature 

test chamber can simulate temperature variations from extreme cold to intense heat, verifying the chip's operational state under different temperature conditions and identifying and eliminating faults caused by material aging, poor 

soldering, structural deformation, etc., in advance. This not only enhances the overall reliability of the chips but also lays the foundation for their long-term stable performance in practical applications.

Core Performance and Parameters

Temperature Range: -70°C to +180°C; Humidity Range: 20% RH to 98% RH

Temperature Uniformity: ≤ ±2°C (empty chamber); Temperature Fluctuation: ≤ ±0.5°C

Heating Rate: Approx. 3°C/min (average for entire process, model-dependent)

Cooling Rate: Approx. 1°C/min (average for entire process, model-dependent)

Inner Chamber Material: Stainless Steel (SUS304)

Control System: Color touchscreen, programmable, supports data logging and export

Compliance Standards: Supports multiple testing standards including IEC, GB, MIL, AEC-Q

As a professional manufacturer of simulated environmental test equipment, SONACME Technology is committed to providing precise and reliable high-low temperature testing solutions for the electronics industry. Our high-low temperature 

test chambers are not only suitable for Bluetooth chips but can also be widely applied to aging tests, performance evaluations, and quality screening of various electronic components, materials, and finished products. The equipment 

features accurate temperature control, fast response, stable operation, and supports customized testing programs to meet testing requirements from R&D to mass production stages.

By utilizing high-low temperature test chambers, companies can effectively improve product quality, reduce post-production failure rates, and enhance market competitiveness. Whether used for chip screening, material weather resistance 

testing, or whole-machine environmental adaptability verification, the high-low temperature test chamber is an indispensable tool for ensuring product quality.

The JPCA-ET05 High-Low Temperature Test Chamber is not only an essential testing device for the Bluetooth chip industry but also a crucial support driving high-quality manufacturing of electronic products. SONACME Technology will 

continue to leverage advanced technology, stable performance, and comprehensive services to help companies build trust and achieve reliable products in demanding environments.